{"id":79,"date":"2009-10-21T23:45:40","date_gmt":"2009-10-22T04:45:40","guid":{"rendered":"http:\/\/blog.hilltech.com\/?p=79"},"modified":"2022-04-06T21:57:09","modified_gmt":"2022-04-07T02:57:09","slug":"ultra-low-silicone-thermal-gap-filler-provides","status":"publish","type":"post","link":"https:\/\/blog.hilltech.com\/?p=79","title":{"rendered":"Ultra-Low Silicone Thermal Gap Filler Provides"},"content":{"rendered":"

ARLINGTON HIEIGHTS, ILLINOIS, USA, October 21, 2009: Hill Tech Sales, a leader in components for electrical power conversion and thermal management today is introducing ultra-low silicone gap fillers<\/a> to its line of thermal interface materials.<\/p>\n

Hill Technical has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W\/mK of thermal conductivity between hot components and their heat sinks. The gap filler\u2019s <\/a>minimal silicone content makes it suitable for use in silicone-sensitive applications including medical electronics, laser optics and telecommunications where silicone-based out gassing can lead to contamination and condensation issues or leave oily residues that interfere with process applications. The TP-S3 family of materials was developed by Chang Sung Corp. and is manufactured by Dongyun Electronics in South Korea.<\/p>\n

Pads of TP-S3LS material are soft and compliant for easy compression and filling of air gaps between irregular mating surfaces. The material\u2019s Shore 00 hardness is 55. TP-S3 pads can be used in temperatures up to 200\u00b0C, which exceeds the use range of silicone-free gap fillers. The material has a UL 94 flame class rating of V-0. Its dielectric breakdown voltage is over 5.0 kV.<\/p>\n

New TP-S3 gap filler material is available in 210 x 297 mm (8.3 in x 11.7 in) sheets or die-cut parts. Standard sheet thicknesses range from 0.5 to 5.0 mm (0.020 in to 0.196 in).\u00a0 Pricing for standard flat TP-S3LS sheets starts at $0.10 per square inch, which is below the cost of other 3.0 W\/mK thermal gap fillers now available. Lower priced TP-S materials are also available with thermal conductivities of 2.0 and 1.0 W\/mK.<\/p>\n

For more information on all TP-S3LS ultra-low silicone gap filler materials, visit www.hilltech.com<\/a> or contact:<\/p>\n

Vince Hill
\nThermal Account Manager
\nHill Technical Sales
\n216 West Campus Drive
\nArlington Heights, IL 60004\u00a0\u00a0\u00a0\u00a0
\nTel: +1- 847-255-4400\u00a0 ext 15
\nFax: +1-847-255-0192\u00a0\u00a0\u00a0\u00a0\u00a0<\/p>\n

You my also visit: http:\/\/www.hilltech.com\/<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

TP-S3LS gap pads contain less than 50 parts per million of silicone while providing 3.0 W\/mK of thermal conductivity between hot components and their heat sinks. 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