Tag Archives: Thermally Conductive Pads

Ultra-Low Silicone Thermal Gap Filler Provides

Posted on October 21, 2009 by

TP-S3LS gap pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of thermal conductivity between hot components and their heat sinks. Continue reading →

Posted in Learning Center, News | Tagged bergquist thermal pad, Thermal Gap Filler, Thermal Gap Pad, Thermal Interface Material, Thermal Management, Thermally Conductive Pads, TIM | 1 Comment

Tag Archives: Thermally Conductive Pads

Ultra-Low Silicone Thermal Gap Filler Provides

Categories

Connect with us.

Instagram LinkedIn