ARLINGTON HIEIGHTS, ILLINOIS, USA, October 21, 2009: Hill Tech Sales, a leader in components for electrical power conversion and thermal management today is introducing ultra-low silicone gap fillers to its line of thermal interface materials.
Hill Technical has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of thermal conductivity between hot components and their heat sinks. The gap filler’s minimal silicone content makes it suitable for use in silicone-sensitive applications including medical electronics, laser optics and telecommunications where silicone-based out gassing can lead to contamination and condensation issues or leave oily residues that interfere with process applications. The TP-S3 family of materials was developed by Chang Sung Corp. and is manufactured by Dongyun Electronics in South Korea.
Pads of TP-S3LS material are soft and compliant for easy compression and filling of air gaps between irregular mating surfaces. The material’s Shore 00 hardness is 55. TP-S3 pads can be used in temperatures up to 200°C, which exceeds the use range of silicone-free gap fillers. The material has a UL 94 flame class rating of V-0. Its dielectric breakdown voltage is over 5.0 kV.
New TP-S3 gap filler material is available in 210 x 297 mm (8.3 in x 11.7 in) sheets or die-cut parts. Standard sheet thicknesses range from 0.5 to 5.0 mm (0.020 in to 0.196 in). Pricing for standard flat TP-S3LS sheets starts at $0.10 per square inch, which is below the cost of other 3.0 W/mK thermal gap fillers now available. Lower priced TP-S materials are also available with thermal conductivities of 2.0 and 1.0 W/mK.
For more information on all TP-S3LS ultra-low silicone gap filler materials, visit www.hilltech.com or contact:
Thermal Account Manager
Hill Technical Sales
216 West Campus Drive
Arlington Heights, IL 60004
Tel: +1- 847-255-4400 ext 15
You my also visit: http://www.hilltech.com/
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