Tag Archives: Thermal Management

KERABSORB™: The Hybrid Solution for Thermal Management and EMI Suppression

Posted on December 4, 2025 by Kimberly Underwood

Electronics are becoming more compact, faster, and powerful as they advance, and are bringing new complex challenges surrounding heat dissipation/thermal management and electromagnetic interference (EMI). The latest innovation from Kerafol® is here to help: let us introduce you to KERABSORB™. … Continue reading →

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Server Farm Efficiency with High-Performance Resistors

Posted on December 3, 2024 by Kimberly Underwood

In the rapidly advancing field of technology, the backbone of a successful server farm lies not just in cutting-edge software or the latest in server hardware, but in the critical infrastructure that supports it. Among the components that play an … Continue reading →

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Metal Core Board

Posted on November 7, 2024 by Kimberly Underwood

If you work in electronic components, you know that electricity generates heat, and that heat can be potentially dangerous to your projects. Over time, without proper thermal management, excessive heat can cause malfunctions, hot spots, solder joint stress, CTE mismatch, … Continue reading →

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Ultra-Low Silicone Thermal Gap Filler Provides

Posted on October 21, 2009 by

TP-S3LS gap pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of thermal conductivity between hot components and their heat sinks. Continue reading →

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