Posts Tagged ‘thermal management’

Standard heat pipe to increase working size in cold plate

Friday, January 15th, 2010

ARLINGTON HEIGHTS, ILLINOIS, USA, Friday, January 15, 2010: Hill Tech Sales, a leader in Components for Thermal Management and Electrical Power Conversion today posted information on standard heat pipes to increase working size in a cold plate.

Most times engineers will look at the standard 30cm length of heat pipe and dismiss using it in an application because their working distance is beyond 30 cm. The same occurrence also applies to heat dissipation being over the rating of a single heat pipe.

Heat Pipe interleave in a cold plate

Heat Pipe interleave in a cold plate

 Both of these issues can easily be addressed by using a properly designed heat pipe assembly. The first issue of length is easily addressed by interleaving heat pipes in a plate assembly with a nominal amount of overlap, in many cases 2 to 3 cm.

 The second issue of enhancing thermal dissipation can be addressed by using the round heat pipes in a flattened state, stacking them side by side in an assembled plate. Since the heat pipes themselves are rather inexpensive, it is good design practice to add additional pipes to improve your design margin.

 Note another inherent advantage in this concept is that this assembly now has improved built-in reliability through redundancy of heat transfer devices in the unlikely event of a single heat pipe failing.

For more questions on this article contact:

Vince Hill
Hill Technical Sales
216 West Campus Drive
Arlington Heights, IL 60004   
Tel: +1- 847-255-4400  ext 12
Fax: +1-847-255-0192    

You may also visit: http://www.hilltech.com/

Ultra-Low Silicone Thermal Gap Filler Provides

Wednesday, October 21st, 2009

ARLINGTON HIEIGHTS, ILLINOIS, USA, October 21, 2009: Hill Tech Sales, a leader in components for electrical power conversion and thermal management today is introducing ultra-low silicone gap fillers to its line of thermal interface materials.

Hill Technical has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of thermal conductivity between hot components and their heat sinks. The gap filler’s minimal silicone content makes it suitable for use in silicone-sensitive applications including medical electronics, laser optics and telecommunications where silicone-based out gassing can lead to contamination and condensation issues or leave oily residues that interfere with process applications. The TP-S3 family of materials was developed by Chang Sung Corp. and is manufactured by Dongyun Electronics in South Korea.

Pads of TP-S3LS material are soft and compliant for easy compression and filling of air gaps between irregular mating surfaces. The material’s Shore 00 hardness is 55. TP-S3 pads can be used in temperatures up to 200°C, which exceeds the use range of silicone-free gap fillers. The material has a UL 94 flame class rating of V-0. Its dielectric breakdown voltage is over 5.0 kV.

New TP-S3 gap filler material is available in 210 x 297 mm (8.3 in x 11.7 in) sheets or die-cut parts. Standard sheet thicknesses range from 0.5 to 5.0 mm (0.020 in to 0.196 in).  Pricing for standard flat TP-S3LS sheets starts at $0.10 per square inch, which is below the cost of other 3.0 W/mK thermal gap fillers now available. Lower priced TP-S materials are also available with thermal conductivities of 2.0 and 1.0 W/mK.

For more information on all TP-S3LS ultra-low silicone gap filler materials, visit www.hilltech.com or contact:

Vince Hill
Thermal Account Manager
Hill Technical Sales
216 West Campus Drive
Arlington Heights, IL 60004    
Tel: +1- 847-255-4400  ext 15
Fax: +1-847-255-0192     

You my also visit: http://www.hilltech.com/